Polymers with low glass transition temperatures are flexible materials and often serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publi-cation is to develop a laser-based method for connecting electromechanically stable conducting paths without exposing the substrate to thermo-mechanical stress. By the use of transmission laser bonding of low-melting eutectic alloys, the necessary energy can precisely be introduced, and process times can be reduced. In this paper, 52In48Sn and 66In34Bi 3D dummy components are successfully joined on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.