The use of glass, particularly fused silica (FS), instead of polymers or semiconductors as optical waveguide material is advantageous due to broadband transmission, reduced propagation losses, and enhanced thermal and mechanical stability. In this contribution, laser glass deposition for the chip-scale fabrication of FS-based optical waveguides is investigated. We use a CO2 laser with emission at a wavelength of 10.6 µm to weld conventional single-mode glass fibers onto a FS substrate, with the aim of maintaining the waveguide properties of the fibers. Synchronized translational and rotational axis movements allow for positioning of the waveguides in arbitrary geometries. Furthermore, a CO2 laser-based cleaving method is introduced, which facilitates on-chip creation of waveguide end facets for optical coupling. An analysis of the cleave geometry in dependence on process parameters as well as optical coupling losses are presented. Coupling losses of 0.88 dB for a laser-cleave and propagation losses of 0.56 dB/cm for a 10 cm on-chip welded fiber were achieved. The results pave the way for on-chip integration of fiber-based systems like lasers, sensing devices or optical communication networks.