Investigation of laser wire bonding for the fabrication of tensegrity structures
13th CIRP Conference on Photonic Technologies LANE 2024
15.-19. September
Fürth
2024
Type: Konferenzbeitrag
Abstract
Tensegrity structures are structures in which elements stabilize each other by bearing compressive or tensile loads. They have a high potential for lightweight design. As structures with tensile loads, wires can be used that are connected to other structures using a laser bonding process. Investigations of bonding a mild steel wire with a diameter of 1 mm onto a flat substrate have been conducted using a coaxial deposition welding head. The influence of the parameters focus position, laser power, wire feed rate and bonding processing time has been investigated regarding the bonding quality. A process window for a stable process and a sufficient bond of wire and substrate was determined. The laser intensity and stickout length have a significant influence on the bonding. High intensities and stickout lengths lead to wire burn back and no bond with the substrate while wire backup occurred at low intensities and stickout lengths.