Utilisation of ultrashort laser pulses enables high precision in laser micromachining processes. Due to low thermal interaction between laser beam and matter, the vicinity of the laser ablation is free from melt and heat influenced zones. Established laser microstructuring processes on basis of femtosecond laser pulses have been applied for manipulation of micromechanical components of Silicon-gyrometers that are manufactured for the automotive industry. Compensation of mechanical imbalance, and adjustment of resonance frequencies have been successfully performed by mass balancing, and manipulation of the spring elements' geometries by laser ablation with a lateral resolution of 10-20 μm, and a vertical resolution of 500 nm-4 μm. The approach for automated laser processing on wafer-level is demonstrated.