Adapted ultra-precision dicing processes are required for implementing hard and brittle materials such as sintered silicon carbide (SSiC) into MEMS applications. Wear and accuracy loss of resin-bonded dicing blades are significant when processing SSiC. Metal-bonded dicing blades can better resist the harsh environment during dicing of SSiC but require frequent dressing to renew the worn-out diamond grains. This paper presents laser dressing of metal-bonded dicing blades to show its capability as an online dressing tool. The laser dressed blades achieve equal sharpness as conventional dressed blades with the advantage of a smaller and more consistent reduction of the blade diameter. Laser pulse lengths of 655 and 12 ps with a wavelength of 532 nm are studied for laser dressing. The dicing blades dressed with 655 ps achieved higher cutting performances in terms of increased substrate roughness and better cutting depth consistency.